ETSC
-Engineer Technical Support Company-
20 years in semiconductor front-end equipment · WET · CMP · Cu Plating · Asher
Root cause → permanent fix, on deadline, against measurable targets — uptime, defect rate, parts cost.
Your first consultation is a free 30-min Fit Call — bring one problem, leave with a straight answer on whether I can help.
Figures reflect my own general experience — no confidential information.
Joined a major DRAM semiconductor manufacturer in 2005 and worked as an Equipment Engineer for approximately 20 years. With extensive experience in DRAM semiconductor manufacturing equipment management and optimization, established an independent consulting business in September 2025.
Experienced in management and cost management. Also capable of English communication through work experience with overseas fabs.
For WET/CMP/Cu plating/Asher, I pinpoint the root cause from the data and drive a permanent fix that stops the recurrence and restores uptime.
Standardized procedures plus solid FDC/APC cut floor workload and waste — an operation that runs on fewer hours.
I rework PM intervals, chemistries and parts usage to cut cost while holding performance — quantified on an annual basis.
I analyze tool logs, SPC and defect data to surface the true cause you couldn’t see — and show the next move in numbers.
OJT support, manuals and technical training move shop-floor know-how from individuals to the organization.
Short-term, spot engagements for problem-solving and expert input — available when you need it, for as much as you need.
Bring one problem. I tell you on the spot whether it’s something ETSC can solve. No sales pitch.
Before any work starts, we fix a measurable target — uptime, defect rate, parts cost — and a committed deadline.
Not a report. I find the true cause on the floor, drive the permanent countermeasure, and measure the result against the number we agreed.
Cleaning process and chemical mechanical polishing optimization. Advanced troubleshooting and process improvement based on 20 years of experience.
Copper plating and ashing process management. Improve equipment performance and achieve cost reduction.
Clean room environment optimization and quality control. Support overall manufacturing environment efficiency.
Detailed analysis of manufacturing data to discover hidden issues and achieve productivity improvements.
Cleaning Process Optimization
Chemical Mechanical Polishing
Copper Plating Process
Ashing Process
Practical solutions based on extensive hands-on experience at a major DRAM semiconductor manufacturer
Quick and flexible response to urgent issues, leveraging the agility of an independent consultant
Flexible pricing compared to major consulting firms
Available in both Japanese and English (experienced in working with overseas fabs)
I publish equipment and process insights through articles and a weekly newsletter. You can see exactly how I frame problems before we ever talk.
Please feel free to contact us regarding any concerns or inquiries about semiconductor manufacturing equipment.
The initial 30-min Fit Call is free of charge.